(Topics include but are not limited to)
Topic 1: Semiconductor Technology
Semiconductor spin physics and topological phenomena
Semiconductor Nanotechnology and Devices
Wide/narrow bandgap semiconductor
Compound semiconductor
magnetic semiconductor
organic semiconductor
Advanced photoresist
Optoelectronics and photovoltaic devices
semiconductor physics
Semiconductor quantum computing
Reliability of Semiconductor Materials and Devices
Semiconductor Manufacturing and Applications
Emerging semiconductor technologies
Intelligent manufacturing
3D Semiconductor Device Technology
3D stacking and packaging technology
High performance network on chip (NoC)
Adaptive Circuit Design
Power management and heat treatment technology
Advanced process nodes
Neural Network Specific Chip (ASIC/FPGA)
Imitating the computing architecture of the human brain
Integrated storage and computing
Distributed AI Computing Framework
Carbon based and compound semiconductors
Electronic applications of carbon nanotubes
High frequency and high-power applications
Thermal characteristics and heat dissipation technology
Flexible electronics and wearable devices
Advanced storage technology
Phase change memory (PCM)
Magnetic reluctance memory (MRAM)
3D NAND and ReRAM
New materials for non-volatile storage
High density and high-speed storage arrays
Gallium Nitride (GaN) and Silicon Carbide (SiC) Devices
High performance computing chip
Topic 2: Integrated Circuit Design
High performance integrated circuit design
Digital Circuit Design
Analog Circuit Design
ADC/DAC design
Low power logic circuit design
FPGA architecture design
Embedded processors and system design
Integrated Sensor Design
Micro processing technology
Integrated Circuit Design and Manufacturing
Very Large Scale Integrated Circuit (VLSI)
System on Chip (SoC) Design
Low power design technology
Integrated Circuit Testing and Verification
Radio Frequency Integrated Circuit (RFID)
Power Management Integrated Circuit (PMIC)
Digital Signal Processor (DSP) and Applications
Lithography technology
Advanced packaging technologies such as TSV, CuNCAP
Aging and Fault Analysis of Integrated Circuits
Integrated Circuit Safety
Design and Optimization of Integrated Electric Vehicle Drive System
Fault diagnosis and repair technology
RF front-end design and optimization
Analog, digital, hybrid, and RF circuit design
Low power tools and design techniques
Sequential Logic Circuit Design
Design of Complementary Metal Oxide Semiconductor Combination Logic Gate
Storage and array structure design
Ultra Large Scale Integrated Design
Topic 3: Integrated Systems
Silicon/germanium devices and device physics
Modeling and Simulation of Organic Semiconductor Devices
Testing, Fault Tolerance, Reliability, and Modeling
Interconnection, low dielectric constant, high dielectric constant, and other processing techniques
Integrated circuit computer-aided design technology, manufacturability design
Signal denoising and processing
Highly integrated front-end circuits and devices
Integrated Circuit for Communication
Physical Design of Integrated Circuits and Systems
Highly integrated front-end circuits and devices
Optical Communication Integrated Circuit
Physical Design of Optoelectronic Integrated Circuits and Systems
Wireless system equipment and circuits
Manufacturing, processing, packaging, and testing technologies for optoelectronic integration and devices
Electronic Design Automation
The data path in digital processors
Embedded/Multiprocessor Systems
Hardware software collaborative design and verification
Devices and circuits for wireless systems

Devices, hardware, and methods for biologically inspired and neuromorphic computing
Manufacturing, processing, packaging, and testing technologies for integrated circuits and devices
Electronic Design Automation
The data path in digital processors
Embedded/Multiprocessor Systems
Hardware software collaborative design and verification