Scopes
(Topics include but are not limited to)
Digital Design
Innovative Design
Industrial product model production
industrial product
product design
Interaction Design
Control system
Home Design
Architectural design
environmental design
Computer aided design
computer graphics
Drawing techniques
Digital Media Art
Multimedia Application Art Design
Analysis and Optimization Design
Environmental and Public Art Design
High performance integrated circuit design
Digital Circuit Design
Analog Circuit Design
ADC/DAC design
Low power logic circuit design
FPGA architecture design
Embedded processors and system design
RF front-end design and optimization
Integrated Sensor Design
Micro processing technology
Lithography technology
Advanced packaging technologies such as TSV, CuNCAP
Aging and Fault Analysis of Integrated Circuits
Integrated Circuit Safety
Design and Optimization of Integrated Electric Vehicle Drive System
Fault diagnosis and repair technology
Semiconductor spin physics and topological phenomena
Semiconductor Nanotechnology and Devices
Wide/narrow bandgap semiconductor
Compound semiconductor
Magnetic semiconductor
Organic semiconductor
Optoelectronics and photovoltaic devices
Semiconductor physics
Semiconductor quantum computing
Physics of Microwave Photon Devices
Reliability of Semiconductor Materials and Devices
Semiconductor Manufacturing and Applications
Emerging semiconductor technologies
Advanced photoresist
Important Dates/重要日期
  • Submission Deadline: 2025.2.16
  • Registration Deadline: 2025.2.21
  • Conference Date: 2025.3.8
  • Notification Date: About a week after the submission
Submission Portal/投稿方式

Mail Address:  ei_yiwjkk@126.com

If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists:

张老师
  • +86-17162863232(微信同号)
  • 3771563441
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