Welcome to ICTSM 2024
2024 International Academic Conference on 3D Technology, Simulation and Modeling
VENUE | 地点
Important Dates | 重要日期
- Submission Deadline: 2024.11.29
- Registration Deadline: 2024.12.4
- Conference Date: 2024.12.19
- Notification Date: About a week after the submission
Submission Portal | 投稿方式
Mail Address: ei_2024conference@126.com
If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists:
田老师
+86-17162865530（微信同号）
3766818743
唐老师
- +86-17168296597（微信同号）
- 3264234551
Indexing Service | 索引服务
Technical Sponsor | 技术赞助商
