Scopes
(The following topics include but are not limited to)
Topic 1: Electronic Science and Technology
Signal Processing
image processing
semiconductor technology
integrated circuit
Physical Electronics
electronic circuit 
microcomputer principle
Microwave and Millimeter Wave Electronics
Optical fiber communication
Digital signal processing
semiconductor physics
Physical Electronics and Electronics
microelectronics
Computer Architecture and Logic Design
Introduction to Electronic Science and Technology
signal and system
Fundamentals of Electronic Circuits
Microcomputer Systems and Interface
Electromagnetic Field Theory
photoelectric technology
Fields and Waves in Information Electronic Technology
Fundamentals of Optoelectronic Physics
Electronic devices
Fundamentals of VLSI Design
display technique 
Topic 2: Integrated Circuits
Integrated Circuit Design and Manufacturing
Very Large Scale Integrated Circuit (VLSI)
System on Chip (SoC) Design
Low power design technology
Radio Frequency Integrated Circuit (RFID)
Power Management Integrated Circuit (PMIC)
Digital Signal Processor (DSP) and Applications
Digital Integrated Circuit Design
Design of Analog and Mixed Signal Circuits
High frequency (RF) and microwave circuit design
Low power circuit design
Reconfigurable and Adaptive Circuit Design
Semiconductor Process Technology
Nanomanufacturing and Process Development
Packaging Technology and 3D Integrated Circuits
Chip testing and fault diagnosis
The Application of Materials Science in Integrated Circuits
The Application of Artificial Intelligence and Machine Learning in Integrated Circuits
Integrated Circuit Solutions for Internet of Things (IoT) Devices
Automotive Electronics and Safety Critical Systems
Integrated Circuit Applications in Consumer Electronics Products
Integrated Circuit Design of Biomedical Electronic Devices
Integrated Circuit Technology in Quantum and Neuromorphic Computing
Silicon photonics integrated circuit
Application of New Devices (such as Memristors) in Integrated Circuit Design
The Safety and Reliability of Integrated Circuits
Market Trends and Challenges in the Integrated Circuit Industry
Modular design and system integration
Topic 3: Semiconductors
Extreme Ultraviolet Photolithography (EUV) Technology
3D Integrated Circuit and Its Manufacturing Process
Advanced packaging and testing technology
Optimization and Automation of Semiconductor Manufacturing Process
New semiconductor materials (such as silicon carbide, gallium nitride, and two-dimensional materials)
Advanced CMOS technology
Efficient power semiconductor devices
Nanoscale electronic devices
other related topics
Important Dates/重要日期
  • Submission Deadline: 2025.5.18
  • Registration Deadline: 2025.5.23
  • Conference Date: 2025.6.2
  • Notification Date: About a week after the submission
Submission Portal/投稿方式

Mail Address:  conference122@126.com

If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists:

宋老师
  • +86-15528045773(微信同号)
  • 3820369236
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