Scopes
(Topics include but are not limited to)
Analog Circuit and Signal Processing
Analog Electronics
Nanoelectronic Circuit
Embedded system
Blockchain
artificial neural network
human-computer interaction
Equipment simulation and modeling
RF equipment and circuits
Bioinformatics
real-time control
data mining
Digital Electronics
Digital Circuits and Signal Processing
Smart Grid Information Engineering
Remote Information Processing
Smart grid technology
Multi domain application of smart grid
Power transmission and distribution
Power quality, protection, and electromagnetic compatibility
Power Engineering Generation Technology
Electric Drivers and Their Applications
Stability control of large power grid
Power System Communication and Control
Intelligent dispatch of power grid
Flexible DC and Flexible Access Technology for Power Grid
3D stacking and packaging technology
High performance network on chip (NoC)
Adaptive Circuit Design
Power management and heat treatment technology
Advanced process nodes
Neural Network Specific Chip (ASIC/FPGA)
Imitating the computing architecture of the human brain
Integrated storage and computing
Distributed AI Computing Framework
Carbon based and compound semiconductors
Electronic applications of carbon nanotubes
High frequency and high-power applications
Thermal characteristics and heat dissipation technology
Flexible electronics and wearable devices
Advanced storage technology
Phase change memory (PCM)
Magnetic reluctance memory (MRAM)
3D NAND and ReRAM
New materials for non-volatile storage
High density and high-speed storage arrays
Gallium Nitride (GaN) and Silicon Carbide (SiC) Devices
High performance computing chip
Analog Circuit and Signal Processing
Analog Electronics
Nanoelectronic Circuit
Embedded system
Blockchain
artificial neural network
human-computer interaction
Equipment simulation and modeling
RF equipment and circuits
Bioinformatics
real-time control
data mining
Digital Electronics
Digital Circuits and Signal Processing
Smart Grid Information Engineering
Remote Information Processing
Smart grid technology
Multi domain application of smart grid
Power transmission and distribution
Power quality, protection, and electromagnetic compatibility
Power Engineering Generation Technology
Electric Drivers and Their Applications
Stability control of large power grid
Power System Communication and Control
Intelligent dispatch of power grid
Flexible DC and Flexible Access Technology for Power Grid
3D stacking and packaging technology
High performance network on chip (NoC)
Adaptive Circuit Design
Power management and heat treatment technology
Advanced process nodes
Neural Network Specific Chip (ASIC/FPGA)
Imitating the computing architecture of the human brain
Integrated storage and computing
Distributed AI Computing Framework
Carbon based and compound semiconductors
Electronic applications of carbon nanotubes
High frequency and high-power applications
Thermal characteristics and heat dissipation technology
Flexible electronics and wearable devices
Advanced storage technology
Phase change memory (PCM)
Magnetic reluctance memory (MRAM)
3D NAND and ReRAM
New materials for non-volatile storage
High density and high-speed storage arrays
Gallium Nitride (GaN) and Silicon Carbide (SiC) Devices
High performance computing chip
Important Dates/重要日期
- Submission Deadline: 2025.1.18
- Registration Deadline: 2025.1.23
- Conference Date: 2025.2.9
- Notification Date: About a week after the submission
Submission Portal/投稿方式
Mail Address: pajkdg_info@126.com
If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists:
张老师
- +86-17162863232(微信同号)
- 3771563441
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